By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher
This publication explains one of many preferred subject matters in instant and digital units group, particularly the instant conversation at mmWave frequencies, particularly on the 60 GHz ISM band. It offers the reader with wisdom and methods for mmWave antenna layout, review, antenna and chip packaging. Addresses useful engineering matters reminiscent of RF fabric overview and choice, antenna and packaging standards, production tolerances, antenna and approach interconnections, and antenna one of many first books to debate the rising learn and alertness components, rather chip applications with built-in antennas, wafer scale mmWave phased arrays and imaging includes a solid variety of case reports to assist realizing presents the antenna and packaging applied sciences for the newest and rising purposes with the emphases on antenna integrations for useful purposes reminiscent of instant USB, instant video, part array, car collision avoidance radar, and imaging
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It refers to a combination of interconnected microwave circuit elements monolithically integrated on a single substrate. The package of a MMIC may be a metal housing or a plastic encapsulation, as will be seen later. While the ﬁrst IC was invented by Jack Kilby back in July 1958 , the ﬁrst MMIC was published about 20 years later by Ray Pengelly and James Turner in 1976 . 9). No backside ground was available at that time and the FETs were grounded externally in the package. The packaging of MMICs is primarily an outgrowth of the microwave hybrid integrated circuit (MIC) technology and the discrete device packaging technology [22, 23].
As such, future mmWave systems on chip will require designers to invent new ways of chip testing. Low-cost and high-volume self tests may use on-chip power detection circuits to implement a built-in self-test (BIST) mechanism. A BIST mechanism is widely used in industry to verify the internal functionality of integrated circuits at lower frequencies. A similar mechanism could be implemented at mmWave frequencies to reduce the cost and complexity of external test equipment. The test-cycle duration and the complexity of automated test equipment is particularly high at mmWave frequencies.
One- and two-dimensional structures will be presented and analyzed and then a discussion ensues of how ‘defects’ can be added to create devices and waveguides that control the propagation of electromagnetic waves. High impedance ground planes are introduced that reduce surface waves and increase efﬁciency and are shown to be useful for corrugated horn antennas and other structures. It is then shown how EBG substrates can improve printed antenna efﬁciency. Low-proﬁle high-gain antennas using EBGs are presented next, followed by high-gain one-, two- and three-dimensional resonator-type antennas and concludes with metamaterial and Woodpile EBG waveguide horn antennas and arrays.
Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher