By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)
Back hide replica sequence: built-in Circuits and platforms 3D-Integration for NoC-based SoC Architectures via: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This e-book investigates at the supplies, demanding situations, and options for the 3D Integration (vertically stacking) of embedded structures hooked up through a community on a chip. It covers the total architectural layout strategy for 3D-SoCs. 3D-Integration applied sciences, 3D-Design options, and 3D-Architectures have emerged as themes severe for present R&D resulting in a wide diversity of goods. This ebook provides a finished, system-level assessment of 3-dimensional architectures and micro-architectures. •Presents a entire, system-level assessment of third-dimensional architectures and micro-architectures; •Covers the complete architectural layout technique for 3D-SoCs; •Includes state of the art therapy of 3D-Integration applied sciences, 3D-Design innovations, and 3D-Architectures.
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J. Dally. Performance analysis of k-ary n-cube interconnection networks. IEEE Transactions on Computers, 39(6):775–785, 1990. â•‡ 4. Y. Weldezion, M. Grange, D. Pamunuwa, Z. Lu, A. Jantsch, R. Weerasekera and H. Tenhunen. Scalability of network-on-chip communication architecture for 3-D meshes. Proceedings of the International Symposium on Networks-on-Chip, 2009. â•‡ 5. F. G. Friedman. 3-D topologies for networks-on-chip. IEEE Transactions on Very Large Scale Integration Systems, 15(10):1081, 2007.
A1 is the area for a 32-bit memory word. Depending on the geometry we assume either SRAM or DRAM memory. For a 2-D system we use the area of embedded SRAM, while for a 3-D system we use DRAM. Concretely we use 60F2 area for one SRAM cell  and between 8F2 and 4F2 for DRAM cells , where F is the minimum feature size. tn • A_intarch is the interconnect area required for transporting a 32-bit word to memory. 5)a2 (tn) + 8a3 (s) if arch = 2D if arch = 3D2 if arch = 3D4 if arch = 3D8 if arch = 3D16 • σ is the interconnect sharing factor.
7c illustrates. It also results in a prohibitively high power consumption since the computation consumes much more power than the memory. Apparently, we cannot power all these computations in reality, but we can translate the increased potential that 3-D offers into either smaller chips, or lower frequency, or higher memory content. 8 shows performance and power consumption for a smaller system (100Â€mm2) clocked at a somewhat lower frequency and at the 35Â€nm technology node. With μsâ•›>â•›4,000 we get a practical power consumption and still a very respectable tera-scale performance.
3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)